Acceleronix & IDEMIA – In-Factory Profile Provisioning (IFPP) solution

March 12, 2026

As IoT deployments scale globally, managing connectivity during device manufacturing becomes increasingly complex. Traditional SIM provisioning approaches can introduce additional SKUs, logistical overhead, delays, and operational risk.

In this video, Acceleronix and IDEMIA Secure Transactions introduce In-Factory Profile Provisioning (IFPP) — an innovative approach that simplifies how connectivity profiles are delivered to devices directly during manufacturing.

IFPP enables secure eSIM profile provisioning inside the factory, eliminating the need for additional post-production steps and reducing operational complexity. By embedding connectivity earlier in the device lifecycle, manufacturers can streamline production, minimize logistics challenges, and accelerate time-to-market.

The solution is designed to support the evolving eSIM ecosystem and addresses market needs ahead of full SGP.42 availability, providing a practical and scalable path for large-scale IoT device deployments.

Key benefits include:

• Reduced cost and operational complexity by eliminating additional SIM SKUs and logistics
• Faster device deployment through connectivity provisioning during manufacturing
• Offline provisioning capabilities without reliance on continuous connectivity
• Secure profile binding and delivery powered by advanced, quantum-safe security mechanisms

By combining Acceleronix’s IoT enablement expertise with IDEMIA Secure Transactions’ trusted security technologies, IFPP provides a secure and efficient framework for delivering operator profiles to connected devices at scale.

Watch the video to learn how IFPP helps device manufacturers and connectivity providers streamline global IoT deployments.